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Product Details
  • image of Solder>WS991LT35T4
  • image of Solder>WS991LT35T4
Model WS991LT35T4
Product Category Solder
Manufacturer Chip Quik, Inc.
Description THERMALLY STABL
Encapsulation -
Package Bulk
RoHS Status 1
Obtain quotation information
Price: $42.4400
Enter Quantity

Quantity

Price

Total Price

1

$42.4400

$42.4400

5

$38.9100

$194.5500

10

$33.6000

$336.0000

25

$30.0600

$751.5000

50

$28.3000

$1,415.0000

100

$26.5300

$2,653.0000

image of Solder>15195075
15195075
Model
15195075
Product Category
Solder
Manufacturer
Chip Quik, Inc.
Description
THERMALLY STABL
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
PDF(1)
PDF(2)
TYPEDESCRIPTION
MfrChip Quik, Inc.
SeriesCHIPQUIK®
PackageBulk
Product StatusACTIVE
CompositionBi57.6Sn42Ag0.4 (57.6/42/0.4)
TypeSolder Paste
Melting Point280°F (138°C)
FormSyringe, 1.23 oz (34.869g)
Mesh Type4
Flux TypeWater Soluble
Storage/Refrigeration Temperature37°F ~ 77°F (3°C ~ 25°C)
Shelf Life StartDate of Manufacture
Shelf Life12 Months
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