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  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0813-02-4BE81-A
  • image of Microcontrollers, Microprocessor, FPGA Modules>TE0813-02-4BE81-A
Model TE0813-02-4BE81-A
Product Category Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Trenz Electronic
Description MODULE MPSOC 4G
Encapsulation -
Package Box
RoHS Status
Price: $565.8400
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image of Microcontrollers, Microprocessor, FPGA Modules>21343463
21343463
Model
21343463
Product Category
Microcontrollers, Microprocessor, FPGA Modules
Manufacturer
Trenz Electronic
Description
MODULE MPSOC 4G
Encapsulation
-
Package
Box
lang_roHSStatusStatus
Product parameters
TYPEDESCRIPTION
MfrTrenz Electronic
SeriesZynq® UltraScale+™
PackageBox
Product StatusACTIVE
Connector TypeBGA
Size / Dimension2.047" L x 2.992" W (52.00mm x 76.00mm)
RAM Size2GB
Operating Temperature0°C ~ 85°C
Module/Board TypeFPGA
Core ProcessorXilinx Zynq UltraScale+ ZU4EG
Flash Size128MB
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