Language:en
  • zh-cn
  • en

USEMI

Product Details
  • image of Adapter, Breakout Boards>PA0060C
  • image of Adapter, Breakout Boards>PA0060C
Model PA0060C
Product Category Adapter, Breakout Boards
Manufacturer Chip Quik, Inc.
Description QFN-16-THIN TO
Encapsulation -
Package Bulk
RoHS Status 1
Price: $7.7900
Enter Quantity

Quantity

Price

Total Price

1

$7.7900

$7.7900

Obtain quotation information
image of Adapter, Breakout Boards>16896797
16896797
Model
16896797
Product Category
Adapter, Breakout Boards
Manufacturer
Chip Quik, Inc.
Description
QFN-16-THIN TO
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrChip Quik, Inc.
SeriesProto-Advantage
PackageBulk
Product StatusACTIVE
Size / Dimension0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions16
Pitch0.026" (0.65mm)
Proto Board TypeSMD to DIP
Package AcceptedQFN
captcha

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
8613434991285
0