Language:en
  • zh-cn
  • en

USEMI

Product Details
  • image of Solder>JET551AX30T5
  • image of Solder>JET551AX30T5
Model JET551AX30T5
Product Category Solder
Manufacturer Chip Quik, Inc.
Description JET PRINTING SO
Encapsulation -
Package Bulk
RoHS Status 1
Obtain quotation information
Price: $91.9500
Enter Quantity

Quantity

Price

Total Price

1

$91.9500

$91.9500

image of Solder>18868357
18868357
Model
18868357
Product Category
Solder
Manufacturer
Chip Quik, Inc.
Description
JET PRINTING SO
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrChip Quik, Inc.
SeriesCHIPQUIK®
PackageBulk
Product StatusACTIVE
CompositionSn63Pb37 (63/37)
TypeSolder Paste
Melting Point361°F (183°C)
FormSyringe, 3.53 oz (100g)
ProcessLeaded
Flux TypeNo-Clean
Shelf Life StartDate of Manufacture
Shelf Life12 Months
captcha

Service hours:9:00-18:00from Monday to Saturday
Please select online customer service:
8613434991285
0