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USEMI
| Model： | IPC0082-S |
|---|---|
| Product Category： | Solder Stencils, Templates |
| Manufacturer： | Chip Quik, Inc. |
| Description： | QFN-20 0.5 MM P |
| Encapsulation： | - |
| Package： | Bulk |
| RoHS Status： | 1 |
|
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Quantity
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Total Price
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$11.5900
$11.5900
| TYPE | DESCRIPTION |
| Mfr | Chip Quik, Inc. |
| Series | Proto-Advantage IPC |
| Package | Bulk |
| Product Status | ACTIVE |
| Material | Stainless Steel |
| Pitch | 0.020" (0.50mm) |
| Type | QFN/LFCSP |
| Inner Dimension | 0.157" L x 0.157" W (4.00mm x 4.00mm) |
| Outer Dimension | 1.300" L x 0.900" W (33.02mm x 22.86mm) |
| Thermal Center Pad | 0.098" L x 0.098" W (2.50mm x 2.50mm) |
| Number of Positions | 20 |
