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Product Details
  • image of IC Sockets>32-6554-10
  • image of IC Sockets>32-6554-10
Model 32-6554-10
Product Category IC Sockets
Manufacturer Aries Electronics, Inc.
Description CONN IC DIP SOC
Encapsulation -
Package Bulk
RoHS Status 1
Price: $16.2000
Enter Quantity

Quantity

Price

Total Price

1

$16.2000

$16.2000

16

$14.0400

$224.6400

32

$13.3100

$425.9200

56

$13.1200

$734.7200

104

$11.5700

$1,203.2800

256

$10.8000

$2,764.8000

504

$10.5700

$5,327.2800

Obtain quotation information
image of IC Sockets>27596
27596
Model
27596
Product Category
IC Sockets
Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOC
Encapsulation
-
Package
Bulk
lang_roHSStatusStatus
1
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrAries Electronics, Inc.
Series55
PackageBulk
Product StatusACTIVE
FeaturesClosed Frame
Mounting TypeThrough Hole
TypeDIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)32 (2 x 16)
TerminationSolder
Material Flammability RatingUL94 V-0
Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingTin
Contact Finish Thickness - Mating200.0µin (5.08µm)
Contact Material - MatingBeryllium Copper
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBeryllium Copper
Termination Post Length0.110" (2.78mm)
Current Rating (Amps)1 A
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