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  • image of IC Sockets>115-93-640-41-003000
  • image of IC Sockets>115-93-640-41-003000
Model 115-93-640-41-003000
Product Category IC Sockets
Manufacturer Mill-Max
Description CONN IC DIP SOC
Encapsulation -
Package Tube
RoHS Status
Obtain quotation information
Price: $5.3000
Enter Quantity

Quantity

Price

Total Price

1

$5.3000

$5.3000

10

$4.8200

$48.2000

30

$4.5600

$136.8000

50

$4.4500

$222.5000

100

$4.2400

$424.0000

250

$3.7100

$927.5000

500

$3.6100

$1,805.0000

1000

$3.0800

$3,080.0000

2500

$2.8600

$7,150.0000

image of IC Sockets>81905
81905
Model
81905
Product Category
IC Sockets
Manufacturer
Mill-Max
Description
CONN IC DIP SOC
Encapsulation
-
Package
Tube
lang_roHSStatusStatus
Product parameters
PDF(1)
PDF(2)
TYPEDESCRIPTION
MfrMill-Max
Series115
PackageTube
Product StatusACTIVE
FeaturesOpen Frame
Mounting TypeThrough Hole
TypeDIP, 0.6" (15.24mm) Row Spacing
Operating Temperature-55°C ~ 125°C
Number of Positions or Pins (Grid)40 (2 x 20)
TerminationSolder
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0µin (0.76µm)
Contact Material - MatingBeryllium Copper
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post200.0µin (5.08µm)
Contact Material - PostBrass Alloy
Termination Post Length0.108" (2.74mm)
Current Rating (Amps)3 A
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